• Best performance, supports up to TDP 130W.
• Heatsink:
- 6 heatpipes, maximized heat transfer.
- High density of aluminum fins, provides large surface for heat dissipation.
- Seamless soldering process and large copper base provide good contact for heat conductivity
- Waved fins to reduce wind shear noise.
• 3 in 1 application
- For LGA775: push pin design for faster install.
- For K8 and latest socket AM2, tool-less clip, easy to install.
• VR Fan
- Silent and powerful VR fan, 16dBA at minimum fan speed.
- Adjustable fan control to boost cooling performance.
